ROGER-TECH is the stocking distributor for EPC2014C, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2014C by email, we will give you a best price according your plan.
Buy EPC2014C with BYCHPS
Buy with guarantee
EPC2014C
- Part Number:
- EPC2014C
- Manufacturer:
- EPC
- Description:
- TRANS GAN 40V 10A BUMPED DIE
- RoHS Status:
- Lead free / RoHS Compliant
- Quantity in Stock:
- 31890 Pieces
- Delivery Time:
- 1-2 days (We have stocks to ship now)
- Production time:
- 4-8 weeks
- Data sheet:
- EPC2014C.pdf
Introduction
Specifications
| Internal Part Number | RO-EPC2014C |
|---|---|
| Condition | Original New |
| Country Origin | Contact us |
| Top Marking | email us |
| Replacement | See datasheet |
| Vgs(th) (Max) @ Id: | 2.5V @ 2mA |
| Vgs (Max): | +6V, -4V |
| Technology: | GaNFET (Gallium Nitride) |
| Supplier Device Package: | Die Outline (5-Solder Bar) |
| Series: | eGaN® |
| Rds On (Max) @ Id, Vgs: | 16 mOhm @ 10A, 5V |
| Power Dissipation (Max): | - |
| Packaging: | Original-Reel® |
| Package / Case: | Die |
| Other Names: | 917-1082-6 |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Input Capacitance (Ciss) (Max) @ Vds: | 300pF @ 20V |
| Gate Charge (Qg) (Max) @ Vgs: | 2.5nC @ 5V |
| FET Type: | N-Channel |
| FET Feature: | - |
| Drive Voltage (Max Rds On, Min Rds On): | 5V |
| Drain to Source Voltage (Vdss): | 40V |
| Detailed Description: | N-Channel 40V 10A (Ta) Surface Mount Die Outline (5-Solder Bar) |
| Current - Continuous Drain (Id) @ 25°C: | 10A (Ta) |
| Email: | [email protected] |
Related parts for EPC2014C
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EPC2015C | EPC | TRANS GAN 40V 33A BUMPED DIE | Inquiry |
 |
EPC2015CENGR | EPC | TRANS GAN 40V 36A BUMPED DIE | Inquiry |
 |
EPC2019ENG | EPC | TRANS GAN 200V 8.5A BUMPED DIE | Inquiry |
 |
EPC2007 | EPC | TRANS GAN 100V 6A BUMPED DIE | Inquiry |
 |
EPC2018 | EPC | TRANS GAN 150V 12A BUMPED DIE | Inquiry |
 |
EPC2020 | EPC | TRANS GAN 60V 90A BUMPED DIE | Inquiry |
 |
EPC2010CENGR | EPC | TRANS GAN 200V 22A BUMPED DIE | Inquiry |
|
EPC2001C | EPC | TRANS GAN 100V 36A BUMPED DIE | Inquiry |
|
EPC2014 | EPC | TRANS GAN 40V 10A BUMPED DIE | Inquiry |
 |
EPC2012CENGR | EPC | TRANS GAN 200V 5A BUMPED DIE | Inquiry |
 |
EPC2020ENG | EPC | TRANS GAN 60V 60A BUMPED DIE | Inquiry |
 |
EPC2012 | EPC | TRANS GAN 200V 3A BUMPED DIE | Inquiry |
 |
EPC2016 | EPC | TRANS GAN 100V 11A BUMPED DIE | Inquiry |
|
EPC2012C | EPC | TRANS GAN 200V 5A BUMPED DIE | Inquiry |
 |
EPC2019 | EPC | TRANS GAN 200V 8.5A BUMPED DIE | Inquiry |
|
EPC2010 | EPC | TRANS GAN 200V 12A BUMPED DIE | Inquiry |
|
EPC2007C | EPC | TRANS GAN 100V 6A BUMPED DIE | Inquiry |
 |
EPC2016C | EPC | TRANS GAN 100V 18A BUMPED DIE | Inquiry |
|
EPC2015 | EPC | TRANS GAN 40V 33A BUMPED DIE | Inquiry |
|
EPC2010C | EPC | TRANS GAN 200V 22A BUMPED DIE | Inquiry |
Latest News
- Toshiba launches SmartMCD series gate driver IC with embedded microcontroller
- ADI deployment Sambanova kit, promoting the production formula AI to achieve breakthrough at an enterprise level
- Honeywell and ADI joined hands to promote the innovation and change of building automation
- MAXIM announced the launch
- MAXIM launches a car DC-DC converter MAX16984, a car with integrated USB charging enumers
- RENESAS Electronics launches the industry's first programmable electrical driver IC
- Renesas launched the first generation of 32-bit RISC-V CPU kernel
- Vishay launched the new 10 MBD low -power light coupling, as low as 5 mA, the voltage range is 2.7 V to 5.5 V
- Melexis launched a new intelligent divert solution to integrate reliable security
- Toshiba has developed the industry's first 2200V dual -carbide MOSFET module to help the efficient and miniaturization of industrial equipment
- The DDR5 era is approaching, and new challenges cannot be ignored
- RENESAS opens the next -generation car SOC and MCU processor product route map