EPC2010CENGR
EPC2010CENGR
Part Number:
EPC2010CENGR
Manufacturer:
EPC
Description:
TRANS GAN 200V 22A BUMPED DIE
RoHS Status:
Lead free / RoHS Compliant
Quantity in Stock:
74402 Pieces
Delivery Time:
1-2 days (We have stocks to ship now)
Production time:
4-8 weeks
Data sheet:
EPC2010CENGR.pdf

Introduction

ROGER-TECH is the stocking distributor for EPC2010CENGR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2010CENGR by email, we will give you a best price according your plan.
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Specifications

Internal Part Number RO-EPC2010CENGR
Condition Original New
Country Origin Contact us
Top Marking email us
Replacement See datasheet
Voltage - Test:380pF @ 100V
Voltage - Breakdown:Die Outline (7-Solder Bar)
Vgs(th) (Max) @ Id:25 mOhm @ 12A, 5V
Technology:GaNFET (Gallium Nitride)
Series:eGaN®
RoHS Status:Tape & Reel (TR)
Rds On (Max) @ Id, Vgs:22A (Ta)
Polarization:Die
Other Names:917-EPC2010CENGRTR
Operating Temperature:-40°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Part Number:EPC2010CENGR
Input Capacitance (Ciss) (Max) @ Vds:3.7nC @ 5V
Gate Charge (Qg) (Max) @ Vgs:2.5V @ 3mA
FET Feature:N-Channel
Expanded Description:N-Channel 200V 22A (Ta) Surface Mount Die Outline (7-Solder Bar)
Drain to Source Voltage (Vdss):-
Description:TRANS GAN 200V 22A BUMPED DIE
Current - Continuous Drain (Id) @ 25°C:200V
Capacitance Ratio:-
Email:[email protected]

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