Measuring 65 x 40 x 4.3mm, its processing centres around quad ARM Cortex-A17 CPUs (Rockchip RK3288), 4Gbyte DRAM (LPDDR3) and choice of on-board flash (eMMC4.5) between 32 and 512Gbyte.
“Most Systems on Modules on the market aren’t solderable by default,” said Sudo. “This is something we have taken to heart after hearing from the customers how tough it is to add the hardware to the board. For that reason, we’ve made SudoProc solderable.”
Initially the module was developed for a digital signage customer, as a media player capable of streaming and displaying multi-source 4K multi-media content without pauses or buffering.
As well as signage, according to Sudo, potential applications include: media players, graphics controllers, laptops and tablets, plus “robotics, autonomous vehicles, infotainment, AR, VR and drones”, the firm’s Dejan Gajsek told Electronics Weekly. “Sudo Systems has a special program for Universities and students if they wish to acquire the system for themselves – 40 to 50% off regular retail price.”
Type | Cortex-A17, ARM (v7) with NEON coprocessor |
Cores | Quad Core |
Speed | 1.8 GHz |
Type | 4GB LPDDR3 (Samsung) |
Speed | 1066MHz |
Configuration | 2 x 32 bit, dual channel |
eDP output | eDPTM Specification, version 1.3 4K x 2K @ 30fps |
HDMI | HDMI 1.4 and 2.0 operation 1080p @ 120 Hz and 4k x 2k @ 60 Hz |
LVDS (optional on demand) | TIA/EIA-644-A 10 data lanes total – single & dual channel |
MIPI PHY | MIPI 0 TX, MIPI 1 RX and TX, MIPI 2 RX 4 data lane, up to 4Gbps 1080p @ 60fps output |
CIF input | 8bits BT656(PAL/NTSC) interface 16bits BT601 DDR interface 8bits/10bits/12bits raw data interface Maximum input resolution 14M(4416×3312) pixels |
Graphics processor | Mali-T764 @ 650MHz 1300Mtri/s, 10.4Gpix/s throughput |
3D graphics engine | Embedded 4 shader cores with shared hierarchical tiler Pixel rate: 2.6G pixels/s @ 400MHz Max frequency: 500MHz OpenGL ES1.1/2.0/3.0, OpenCL 1.1/1.2 and DirectX 11 |
2D graphics engine | Max frequency: 500MHz Pixel rate : 320Mpix/s without scale , 256Mpix/s with scale@ 400MHz |
Video processing unit | H.264 decoder 2160p@24fps, H.265 decoder 2160p@30fps and H.264/MVC/VP8 encoder 1080p@30fps |
Image Processor | Image pre-processor Video stabilization Image Post-Processor (embedded inside video decoder) Image Enhancement-Processor (IEP) |
JPEG Codec | Decoder 48×48 to 8176×8176(66.8 Mpixels) Encoder 96×32 to 8192×8192(64 Mpixels) YCbCr 4:0:0, 4:2:0, 4:2:2, 4:4:0, 4:1:1 and 4:4:4 From RGB444 and BGR444 up to RGB101010 and BRG101010 |
I2S | Up to 8 channels (4xTX, 2xRX) Audio resolution from 16bits to 32bits Sample rate up to 192KHz 8 channel, 192KHz, 16 bit and 32 bit |
SPDIF (optional on demand) | Support 16, 20, 24 bits audio data transfer in linear PCM mode |
RGMII interface | 10/100/1000-Mbps Supports IEEE 802.3x and IEEE 802.1Q |
SDIO interface | 3.0 Protocol 4 bit data bus |
Type | eMMC4.5 |
Interface | 8 bit, 200MB/s |
Capacity | 32GB / 64GB / 256GB |
NAND Flash interface | 8bits, up to 4 banks Async or sync DDR up to 75MHz Up to 60bits hardware ECC |
SDMMC interface | SDMMC 3.0 (4 bit) |
Capacity | 32GB / 64GB / 256GB |
SPI | 3x master or slave mode with 2 chip select outputs |
UART | 5x Asynchronous (3 with flow control) up to 4 Mbps or other special baud rate 64 Byte FIFO for TX/RX operation |
I2C | 5x Multi-master operation Support 7bits and 10bits address mode up to 400Kbit/s |
SAR-ADC | 3 channel (10 bit) up to 1 MSPS 0V to 1.8V |
USB host 2.0 | Supports high-speed(480Mbps), full-speed(12Mbps) and low-speed (1.5Mbps) mode Provides 16 host mode channels |
USB OTG | Compatible with USB OTG2.0 specification Supports high-speed(480Mbps), full-speed(12Mbps) and low-speed (1.5Mbps) mode Provides 9 host mode channels |
HSIC 2.0 interface (optional on demand) | Compliant with the USB2.0 Specification |
HSIC 2.0 interface (optional on demand) | |
GPS interface | Complete 1-band, C/A, and NMEA-0183 compatibility Support reference frequencies 16.368MHz 32 DMA channels for AHB master access |
Host interface | Low Pin Count interface(8 inputs/16 outputs or 16 inputs/8 outputs) All signals driven using source synchrounous clock. (2 DDR clock signals per direction for TX and RX paths) |
PS2 interface (optional on demand) | Support PS/2 master mode up to 33kHz |
Smart card (optional on demand) | T0, T1 |
TS interface | Supports 2 Built-in PTIs 64 PID filters CSA v2.0 standard, up to 104Mbps 4/8 PCR extraction channels 8/10 bit |
PWM (with interrupt) | 4x 32-bit timer/counter |
GPIOs (all can be used as interrupt) | up to 100x |
AES | up to 256bit |
DES and TDES | ECB and CBC modes) |
SHA | SHA-1 to SHA-512 |
PKA | From 128 bit to 3136 bit in steps of 32 bits |
Cortex-A12 security mode | TZMA and TZPC |
eFUSE | 2x (one 256bits (32×8) and one 1024bits (32×32)) |
Input voltage | 5V (±10%) |
Input current max | 3A |
PMIC | ACT8846 |
PMIC remote control | YES (with GPIO, I2C, Reset) |
I/O operation range | 3.3V or 2.5V or 1.8V (±10%), depending on the port configuration |
Output mode | Independent output control over I2C |
Output 1 | 3.3V/2A |
Output 2 | 2V/1A |
Output 3 | 3.3V/150mA |
Output 4 | 3.3V/350mA |
Output 5 | 3.3V/350mA |
Output 6 | 3.3V/350mA |
Output 7 | 1.8V/150mA |
Output 8 | 1.8V/350mA |
Input 2 | Vcc MAC (1.8 – 3.3V) |
Input 3 | Vcc CIF/TS (1.8 – 3.3V) |
Max TDP | 10W |
Heatsink | Additional heatsink is not required with proper PCB thermal design. |
Operating temperature range | -25°C to +85°C |
Storage temperature range | -25°C to +85°C |
Cortex-A12 security mode | TZMA and TZPC |
eFUSE | 2x (one 256bits (32×8) and one 1024bits (32×32)) |
Footprint | LGA218 (custom) |
Pin count | 218 |
Dimensions | L: 65 mm W: 40 mm H: 4.3 mm |
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