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Anshen Mei Semiconductor released industrial motor driven integration solutions in APEC 2021

  • Author:ROGER
  • Release on:2021-06-30



June 15, 2021- Promote high energy innovationAnsenmeisemiconductor (On Semiconductor, NASDAQ), ON),Introduced new, integrated, converter - inverter - power factor correction (PFC) Module forindustryMotor drive, servo drive and HVAC (HVAC) Motors driven by driver fans and pumps.

newNXH50M65L4C2SGwithNXH50M65L4C2ESGStandard alumina based (Ai2O3) Substrate and enhanced low thermal resistive substrateDie-casting mode power integrationModule (TMPIM) . These modules are ideal for strong industrial applications with high output power, including a converter-Inverter-PFCCircuit, four integrated75 A,1600 VThe single-phase converter of the rectifier is composed. Three-phase inverter use6Integrated reversediodeof50 a,600 VofIGBT, Dual channel interleavedPFCIncluding two integrated reversediodeof75 a,650 V PFC IGBTAnd two50 a,650 V PFCdiode. Die-casting power integrated module is embedded in a negative temperature coefficient (NTC) Thermistor to monitor the temperature of the device during operation.

Due to the module, pre-confess is based on optimized layout and configuration. PCB Compared with the discrete design, the parasitic element is very small, it is realized 18 kHz with 65 kHz Among the width PFC Switching frequency range. High energy efficiency NXH50M65L4C2SG with NXH50M65L4C2ESG Rated current 50 aCan be up to up to 8 kW Used in the app, it isAnsenmeisemiconductor TMPIM The latest device of the series. The rated current of other devices is 20 a with 30 a.

Compact die-casting moldDIP-26Package size is only73Millimeterx 47Millimeterx 8Millimeter-Save than current solutions20%The area achieves a higher power density level. Sealed and strong packages include an integrated heat sink (distance from the pin)6Mm) and provides high levels of corrosion resistance.

AnsenmeisemiconductorSticonarized silicon carbide (SiC) Configuration options to further increase the switching frequency and energy efficiency.

newNXH50M65L4C2SGwithNXH50M65L4C2ESGWithFAN9672 PFCController and doordriverProgram, including newNCD5700XSeries devices. Recently launchedNCD57252Dual channel isolation typeIGBT/ MOSFETGatedriverprovide5 kVElectric isolation, can be configured as a double lower bridge, double bridge or half bridge.NCD57252SmallSOIC-16Wide body packaging, accept logic level input (3.3 V,5 Vwith15 V). This high current device (under the Miller platform voltage, source current4.0 A /Glow6.0 a) Suitable for high speed, because typical propagation delays are60 ns.

Drive the motor with the highest energy efficiency is a simplified installation, reducing heat accumulation, improving reliability, and reducing system cost. Ansenmeisemiconductorof TMPIM Devices will be standardized to output pins, minimize parasitic elements, provide high-performance "Plug" scheme for designers. will NXH50M65L4C2SG with NXH50M65L4C2ESG versus Fan9672 with NCD57252 Combine, provide a quick design path to achieve precision high energy efficiency motor control scheme.

in APEC 2021 period,AnsenmeisemiconductorWill be displayed for industrial applications SiCProgram. For registration, please visithttp://apec-conf.org/conference/registration/.