SPHWHAHDNM271ZW2D3
- Nomor bagian:
- SPHWHAHDNM271ZW2D3
- Pabrikan:
- Samsung Semiconductor
- Deskripsi:
- LED COB D 2700K SQUARE
- Jumlah dalam Stok:
- 71971 Pieces
- Waktu pengiriman:
- 1-2 days (We have stocks to ship now)
- Waktu produksi:
- 4-8 weeks
- Lembaran data:
- SPHWHAHDNM271ZW2D3.pdf
pengantar
We can supply SPHWHAHDNM271ZW2D3, use the request quote form to request SPHWHAHDNM271ZW2D3 pirce and lead time.XXX.com a professional electronic components distributor. With 3+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number SPHWHAHDNM271ZW2D3.The price and lead time for SPHWHAHDNM271ZW2D3 depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part# SPHWHAHDNM271ZW2D3.We look forward to working with you to establish long-term relations of cooperation
Spesifikasi
| Nomor Bagian Internal | RO-SPHWHAHDNM271ZW2D3 |
|---|---|
| Kondisi | Original New |
| Negara Asal | Contact us |
| Penandaan Top | email us |
| Penggantian | See datasheet |
| Panjang gelombang: | - |
| Tegangan - Teruskan (Vf) (Typ): | 51V |
| melihat Sudut: | 115° |
| Mengetik: | Chip On Board (COB) |
| Suhu - uji: | 85°C |
| Ukuran / Dimensi: | 28.00mm L x 28.00mm W |
| Seri: | COB D Gen3 |
| Pengemasan: | Tray |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Lumens / Watt @ sekarang - Uji: | 129 lm/W |
| Permukaan Emitting Light (LES): | 22.00mm Diameter |
| Jenis lensa: | Flat |
| Tinggi: | 1.50mm |
| Flux @ Current / Temperature - Test: | 10643 lm (Typ) |
| fitur: | - |
| Detil Deskripsi: | LED Lighting COBs, Engines, Modules Chip On Board (COB) COB D Gen3 White, Warm Square |
| Saat ini - Uji: | 1.62A |
| Saat ini - Max: | 4.14A |
| Konfigurasi: | Square |
| Warna: | White, Warm |
| CRI (Color Rendering Index): | 90 |
| CCT (K): | 2700K 2-Step MacAdam Ellipse |
| Email: | [email protected] |
bagian terkait untuk SPHWHAHDNM271ZW2D3
Latest Berita
- Desain inverter kulkas MOSFET pertama Samsung menggunakan yingfailing 600V coolmentm pfd7
- Samsung dan Kerjasama AMD: Chip Exynos dilengkapi dengan AMD GPU
- Produksi Massal Samsung Latest Ponsel Flash Solusi Berdasarkan LPDDR5 dan UFS Paket Multi-Chip UMCP
- Analis: Samsung akan mengakuisisi perusahaan chip mobil, NXP adalah salah satu kandidat
- Samsung Electronics diharapkan pulih normal pada Juni pada bulan Juni pada bulan Juni, Samsung Electronics.
- Samsung mengembangkan kapasitor keramik multi-layer baru untuk menghilangkan kebisingan frekuensi tinggi
- Samsung Motor Research and Development 5G ponsel dengan kapasitansi tipis tiga kaki
- Keuntungan dari Samsung Chip Capacitor
- ROGER TECHNOLOGY Kapasitor SAMSUNG semua seri stok baru
- [Dokumen Teknis Samsung Electro-Mechanics] ESL MLCC rendah
- Impedansi Komponen Pasif