• The new generation of Airfast RF multi-chip module (MCM) utilizes the performance of NXP's latest LDMOS technology and integrated design technology to extend the frequency coverage to 4.0 GHz
• Higher output power than the previous generation supports the deployment of more powerful 5G mMIMO radios to cover larger urban areas
• Increase the efficiency to 45% at 2.6 GHz, helping to reduce the overall power consumption of the 5G network

Eindhoven, Dutch, December 2, 2020 (Global News)- NXP Semiconductors(NASDAQ: NXPI) today announced the launch of its^secondThe new generation of comprehensive Airfast RF power multi-chip module (MCM) is designed to support the development of 5G mMIMO active antenna system requirements for cellular base stations.The new all-in-one power amplifier module series focuses on accelerating 5G coverage. It is based on NXP’s latest LDMOS technology, which provides higher output power, extended frequency coverage and higher efficiency-all of which are compatible with NXP MCM within the same footprint of the first generation product.

The new AFSC5G26E38 Airfast module is a typical example of the enhanced performance provided by the second-generation MCM series.Compared with the previous generation of products, the device can provide 20% of the output power, thus solving the need for wider 5G coverage for each base station tower without increasing the size of the radio unit.It also has a power added efficiency of 45%, which is 4% higher than the previous generation, thereby reducing the power consumption of the 5G network as a whole.The new AFSC5G40E38 demonstrates the performance of NXP’s latest generation LDMOS at high frequencies, which can meet the 5G C-band requirements from 3.7 to 4.0 GHz, and has recently beenSelected by NEC Rakuten Mobile.Japan.

"NXP's latest multi-chip modules increase efficiency through the latest enhancements and enhanced integration of LDMOS," he said. Paul Hart , Executive Vice President and General Manager of NXP Radio power."Our proactive integration drive brings more functionality to each module, which means fewer components for our customers to purchase, assemble and test.The result is a more powerful, yet more cost-effective compact design.For our customers and mobile network operators who are solving 5G expansion needs, this means that products can be brought to the market faster. "

AComprehensiveMulti-chip module combination for5G expansion
NXP's RF power multi-chip modules include LDMOS ICs with integrated Doherty splitter and combiner pairing and 50 ohm input/output matching.Such a high level of integration eliminates the complexity of RF, eliminates multiple prototype designs, and reduces the number of components at the same time, helping to improve yield and shorten the pass cycle.2.^secondThe generation supplements the initial series released last year, extending the frequency and power level.Both generations of products use the same pin output format, allowing RF designers to quickly expand from one design to another design, thereby reducing overall development time.

2^secondThe MCM of Airfast is made by1 set0new deviceCovers the 5G frequency band from 2.3 to 4.0 GHz, with average output power from 37 to 39 dBm.The device has now passed the qualification, and will get the new NXP RF Circuit Collection(Digital library of RF power reference circuit) support.

NXP's 5G access edge product portfolio
From antennas to processors, NXP provides a powerful combination of technologies that can power the 5G access edge to provide first-class performance and security for infrastructure, industrial and automotive applications.This includes the company's Airfast RF power solution series and its Layerscape series of programmable baseband processors for wireless data links, fixed wireless access and small cell devices.To learn more, please visitnxp.com/5G.