On March 14, Infineon Technology Co., Ltd. (FSE: IFX / OTCQX: Ifnny) recently launched a new use of PQFN 2 x 2 mm²Encapsulated Optimos^TM 5 25 V and 30 V power MOSFET products series, aiming to establish a new industry standard for separate power MOSFET technology. These new devices use thin wafer technology and innovative packaging, with very small size but significant performance advantages. Optimos 5 25 V and 30 V power MOSFET product series have optimized the synchronization rectifier in SMPS applications such as server, communication, portable charging, and wireless charging. These power MOSFETs can also be applied to ESC (electronic speed control) modules for small brushless motors in drones. As we all know, drones usually require small and light weight components.

These leading power MOSFET devices are packaged in PQFN 2X2, which have higher power density, small shape size, and extremely low -pitch resistance in the industry, which can further reduce energy consumption. 2 x 2 mm²The small -size packaging provides higher flexibility for the PCB layout wiring. In addition, the solution also has excellent electrical performance, which can further improve the power density of the terminal application and reduce the shape size. At the same time, the reduction of the system temperature and the improvement of performance also make the heat management easier. These characteristics help to achieve smaller customer applications, fully save space, reduce system costs, and create products that are easy to design.

Supply

Optimos encapsulated with PQFN 2x2^TM 5 25 V and 30 V power MOSFET product series are now available:

· Pqfn 2x2 25 V: 2 x 2 mm², RDS (on) 2.4 m? (ISK024NE2LM5)

· Pqfn 2x2 30 V: 2 x 2 mm², RDS (on) 3.6 m? (ISK036N03LM5)