FDB3632_SB82115
FDB3632_SB82115
Artikelnummer:
FDB3632_SB82115
Hersteller:
ON Semiconductor
Beschreibung:
INTEGRATED CIRCUIT
RoHS-Status:
Bleifrei / RoHS-konform
Menge auf Lager:
80515 Pieces
Lieferzeit:
1-2 days (We have stocks to ship now)
Produktionszeit:
4-8 weeks
Datenblatt:
FDB3632_SB82115.pdf

Einführung

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Spezifikation

Interne Teilenummer RO-FDB3632_SB82115
Bedingung Original New
Herkunftsland Contact us
Top-Markierung email us
Ersatz See datasheet
VGS (th) (Max) @ Id:4V @ 250µA
Vgs (Max):±20V
Technologie:MOSFET (Metal Oxide)
Supplier Device-Gehäuse:D²PAK (TO-263AB)
Serie:PowerTrench®
Rds On (Max) @ Id, Vgs:9 mOhm @ 80A, 10V
Verlustleistung (max):310W (Tc)
Verpackung:Bulk
Verpackung / Gehäuse:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Betriebstemperatur:-55°C ~ 175°C (TJ)
Befestigungsart:Surface Mount
Bleifreier Status / RoHS-Status:Lead free / RoHS Compliant
Eingabekapazität (Ciss) (Max) @ Vds:6000pF @ 25V
Gate Charge (Qg) (Max) @ Vgs:110nC @ 10V
Typ FET:N-Channel
FET-Merkmal:-
Antriebsspannung (Max Rds On, Min Rds On):6V, 10V
Drain-Source-Spannung (Vdss):100V
detaillierte Beschreibung:N-Channel 100V 12A (Ta), 80A (Tc) 310W (Tc) Surface Mount D²PAK (TO-263AB)
Strom - Ununterbrochener Abfluss (Id) bei 25 ° C:12A (Ta), 80A (Tc)
Email:[email protected]

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