1) SOT, SOP, SOIC

SOT 'is a patch packaging. As long as the device that does not exceed 5 feet, this packaging shape will be used. Its size is relatively small. Many crystal pipes use this packaging; SOP is a form of component packaging form.It is also one of the most common forms of packaging in the chip. The materials are relatively rich. Plastic, ceramics, metal and even glass can be made, but most of the plastic packaging is now used; SOIC refers to the packaging of small shape integrated circuits.It has two types of packaging in width/narrow body. Compared with DIP packaging, the thickness will be about 70 % thicker, and space will be reduced by 30 to 50 %.

2) QFN, QFP

QFN is a flat packaging of the Quartet without capping. There are configuration electrode contacts on the four sides. Because there are no pins, the possession is smaller than QFP and the height is lower.QFP is a flat packaging of square pins. Generally, it is square, with tube feet on all sides. The distance between the CPU chip pins implemented by this packaging is very small and the tube is very thin. Generally, large or large -scale integrated circuits are used.In the form of packaging, the number of pins is generally above 100.Because its encapsulation size is small, the parasitic parameters are reduced, which is suitable for high -frequency applications.

3) BGA, CSP

BGA and CSP are the ball array packaging and chip size packaging, the spherical contact line, and one of the surface packaging packaging.On the back of the printing substrate, the ball -shaped convex point is used to replace the pin. The LSI chip is assembled on the front of the printed substrate, and then the mold resin or irrigation method is used to seal.CSP packaging is a chip -level package. We all know that the chip is basically known for smallization. Therefore, the latest generation of memory chip packaging technology of CSP packaging can make the size of the chip area and the packaging area exceeding 1: 1.14, which is quite close to itThe ideal situation of 1: 1 is rated as the highest form of a single chip by the industry. Compared with BGA packaging, the CSP packaging in the same space can increase the storage capacity to trip.